Modeling Superposition of Flat Plate Film Cooling Under Complicated Conditions Using Recurrent Neural Networks
Film Cooling is an important and widely used technology to protect hot sections of gas turbines. The last decades witnessed a fast grow of research and publications in the field of film cooling. However, except for the correlations for single row film cooling and the Seller correlation for cooling superposition, there were rarely generalized models for film cooling under superposition conditions. Meanwhile, the numerous data obtained for complex hole distributions were not emerged or integrated from different sources, and recent new data had no avenue to contribute to a compatible model. The technical barriers that prevented generalization from happening for film cooling are: a) the lack of a generalizable model; b) the large number of input variables to describe film cooling. The present study aimed at establishing a generalizable model to describe multiple row film cooling under a large parameter space, including hole locations, hole size, hole angles, blowing ratios etc. The model allowed data with different length and different surface areas to chip in, in the form 1-D sequences. A Long Short Term Memory model was designed to model the local behavior of film cooling. Careful training, testing and validation were conducted to regress the model. The presented results showed that the method was accurate within the CFD data set generated in this study. The presented method could serve as a base model that allowed past and future film cooling research to contribute to a common data base. Meanwhile, the model also allowed transfer learning from the presented data set to experimental data sets, data in the literature and also data in the future.
Modeling Superposition of Flat Plate Film Cooling Under Complicated Conditions Using Recurrent Neural Networks
Category
Technical Paper Publication
Description
Session: 10-10 Film Cooling Optimization and Machine Learning
ASME Paper Number: GT2020-15131
Start Time: September 24, 2020, 08:00 AM
Presenting Author: Li Yang
Authors: Li Yang Shanghai Jiao Tong University
Qi Wang Shanghai Jiao Tong University
Yu Rao Shanghai Jiao Tong University